Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Woodhead Publishing Series in Electronic and Optical Materials - Zhang, Hengyun (Shanghai University of Engineering Science, China) - Bøger - Elsevier Science & Technology - 9780081025321 - 15. november 2019
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Woodhead Publishing Series in Electronic and Optical Materials

Zhang, Hengyun (Shanghai University of Engineering Science, China)

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Woodhead Publishing Series in Electronic and Optical Materials

434 pages

Medie Bøger     Paperback Bog   (Bog med blødt omslag og limet ryg)
Udgivet 15. november 2019
ISBN13 9780081025321
Forlag Elsevier Science & Technology
Antal sider 434
Mål 229 × 153 × 30 mm   ·   580 g

Se alt med Zhang, Hengyun (Shanghai University of Engineering Science, China) ( f.eks. Paperback Bog )