Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Jennie Hwang - Bøger - Van Nostrand Reinhold Inc.,U.S. - 9780442013530 - 24. september 1992
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly New edition

Jennie Hwang

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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly New edition

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.

456 pages, 77 black & white illustrations, biography

Medie Bøger     Paperback Bog   (Bog med blødt omslag og limet ryg)
Udgivet 24. september 1992
ISBN13 9780442013530
Forlag Van Nostrand Reinhold Inc.,U.S.
Antal sider 456
Mål 152 × 229 × 24 mm   ·   639 g
Sprog Engelsk  
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