Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics - Jong-Hoon Lee - Bøger - Springer International Publishing AG - 9783031005756 - 31. december 2007
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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics

Jong-Hoon Lee

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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics

Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

108 pages, X, 108 p.

Medie Bøger     Paperback Bog   (Bog med blødt omslag og limet ryg)
Udgivet 31. december 2007
ISBN13 9783031005756
Forlag Springer International Publishing AG
Antal sider 108
Mål 241 g
Sprog Engelsk  
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