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![Cover for Jie Cheng · Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses (Paperback Bog) [Softcover reprint of the original 1st ed. 2018 edition] (2019)](https://imusic.b-cdn.net/images/item/original/851/9789811355851.jpg?jie-cheng-2019-research-on-chemical-mechanical-polishing-mechanism-of-novel-diffusion-barrier-ru-for-cu-interconnect-springer-theses-paperback-bog&class=scaled&v=1605300811)