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![Cover for Seonho Seok · Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing (Paperback Bog) [Softcover Reprint of the Original 1st 2018 edition] (2019)](https://imusic.b-cdn.net/images/item/original/612/9783030085612.jpg?seonho-seok-2019-advanced-packaging-and-manufacturing-technology-based-on-adhesion-engineering-wafer-level-transfer-packaging-and-fabrication-techniques-using-interface-energy-control-method-springer-series-in-advanced-manufacturing-paperback-bog&class=scaled&v=1614827322)