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Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition
R.R. Tummala
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Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition
R.R. Tummala
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.
657 pages, biography
| Medie | Bøger Hardcover bog (Bog med hård ryg og stift omslag) |
| Udgivet | 31. januar 1997 |
| ISBN13 | 9780412084515 |
| Forlag | Chapman and Hall |
| Antal sider | 628 |
| Mål | 155 × 235 × 36 mm · 993 g |
| Sprog | Engelsk Fransk |
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