Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging - John W. Mccormick - Bøger - Springer - 9780792376767 - 31. januar 2003
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Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging 2003 edition

John W. Mccormick

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Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging 2003 edition

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

347 pages, 266 black & white illustrations, biography

Medie Bøger     Hardcover bog   (Bog med hård ryg og stift omslag)
Udgivet 31. januar 2003
ISBN13 9780792376767
Forlag Springer
Antal sider 347
Mål 155 × 235 × 22 mm   ·   743 g
Sprog Engelsk  
Klipper/redaktør Balde, John W.

Se alt med John W. Mccormick ( f.eks. Hardcover bog )