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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Softcover Reprint of the Original 1st Ed. 1998 edition
Way Kuo
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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Softcover Reprint of the Original 1st Ed. 1998 edition
Way Kuo
420 pages, biography
| Medie | Bøger Paperback Bog (Bog med blødt omslag og limet ryg) |
| Udgivet | 14. marts 2014 |
| ISBN13 | 9781461375968 |
| Forlag | Springer-Verlag New York Inc. |
| Antal sider | 420 |
| Mål | 155 × 235 × 22 mm · 589 g |
| Sprog | Engelsk |
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