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Die-stacking Architecture - Synthesis Lectures on Computer Architecture Yuan Xie
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Die-stacking Architecture - Synthesis Lectures on Computer Architecture
Yuan Xie
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
| Medie | Bøger Paperback Bog (Bog med blødt omslag og limet ryg) |
| Udgivet | 10. juni 2015 |
| ISBN13 | 9783031006197 |
| Forlag | Springer International Publishing AG |
| Antal sider | 113 |
| Mål | 150 × 220 × 10 mm · 231 g |
| Sprog | Engelsk |
![Cover for Yuan Xie · Three-dimensional Integrated Circuit Design: Eda, Design and Microarchitectures - Integrated Circuits and Systems (Paperback Bog) [Previously Published in Hardcover edition] (2012)](https://imusic.b-cdn.net/images/item/original/137/9781461425137.jpg?yuan-xie-2012-three-dimensional-integrated-circuit-design-eda-design-and-microarchitectures-integrated-circuits-and-systems-paperback-bog&class=scaled&v=1608807059)
![Cover for Yuan Xie · Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures - Integrated Circuits and Systems (Hardcover bog) [2010 edition] (2009)](https://imusic.b-cdn.net/images/item/original/837/9781441907837.jpg?yuan-xie-2009-three-dimensional-integrated-circuit-design-eda-design-and-microarchitectures-integrated-circuits-and-systems-hardcover-bog&class=scaled&v=1582820453)