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Reliability Analysis of Electrotechnical Devices
Cher Ming Tan
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Reliability Analysis of Electrotechnical Devices
Cher Ming Tan
| Medie | Bøger Hardcover bog (Bog med hård ryg og stift omslag) |
| Udgivet | 20. juli 2022 |
| ISBN13 | 9783036546537 |
| Forlag | Mdpi AG |
| Antal sider | 174 |
| Mål | 576 g |
| Sprog | Tysk |
![Cover for Cher Ming Tan · Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology (Paperback Bog) [2013 edition] (2013)](https://imusic.b-cdn.net/images/item/original/208/9789814451208.jpg?cher-ming-tan-2013-electromigration-modeling-at-circuit-layout-level-springerbriefs-in-applied-sciences-and-technology-paperback-bog&class=scaled&v=1394616643)
![Cover for Cher Ming Tan · Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections - Springer Series in Reliability Engineering (Paperback Bog) [2011 edition] (2013)](https://imusic.b-cdn.net/images/item/original/416/9781447126416.jpg?cher-ming-tan-2013-applications-of-finite-element-methods-for-reliability-studies-on-ulsi-interconnections-springer-series-in-reliability-engineering-paperback-bog&class=scaled&v=1410620946)
![Cover for Cher Ming Tan · Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections - Springer Series in Reliability Engineering (Hardcover bog) [2011 edition] (2011)](https://imusic.b-cdn.net/images/item/original/091/9780857293091.jpg?cher-ming-tan-2011-applications-of-finite-element-methods-for-reliability-studies-on-ulsi-interconnections-springer-series-in-reliability-engineering-hardcover-bog&class=scaled&v=1394616648)
