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Through Silicon Vias: Materials, Models, Design, and Performance Kaushik, Brajesh Kumar (Indian Institute of Technology-Roorkee, India) 1. udgave
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Through Silicon Vias: Materials, Models, Design, and Performance
Kaushik, Brajesh Kumar (Indian Institute of Technology-Roorkee, India)
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
216 pages
| Medie | Bøger Paperback Bog (Bog med blødt omslag og limet ryg) |
| Udgivet | 30. juni 2020 |
| ISBN13 | 9780367574543 |
| Forlag | Taylor & Francis Ltd |
| Antal sider | 216 |
| Mål | 150 × 220 × 10 mm · 453 g |
| Sprog | Engelsk |
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