Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science - Erdogan Madenci - Bøger - Kluwer Academic Publishers - 9781402073304 - 31. december 2002
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition

Erdogan Madenci

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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition

Discusses specific steps of the analysis method through examples without leaving any room for confusion. This title allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.


205 pages, biography

Medie Bøger     Hardcover bog   (Bog med hård ryg og stift omslag)
Udgivet 31. december 2002
ISBN13 9781402073304
Forlag Kluwer Academic Publishers
Antal sider 205
Mål 156 × 234 × 12 mm   ·   489 g
Sprog Engelsk  

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