Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects - Dean L. Monthei - Bøger - Springer-Verlag New York Inc. - 9781461373254 - 14. marts 2014
Ved uoverensstemmelse mellem cover og titel gælder titel

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects Softcover reprint of the original 1st ed. 1999 edition

Dean L. Monthei

Pris
DKK 861

Bestilles fra fjernlager

Forventes klar til forsendelse 9. - 15. sep.

Vores kunder siger:

14 dages fuld returret
Topvurdering på Trustpilot
Tilføj til din iMusic ønskeseddel
Eller

Findes også som:

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects Softcover reprint of the original 1st ed. 1999 edition

Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

248 pages, 62 black & white illustrations, biography

Medie Bøger     Paperback Bog   (Bog med blødt omslag og limet ryg)
Udgivet 14. marts 2014
ISBN13 9781461373254
Forlag Springer-Verlag New York Inc.
Antal sider 234
Mål 155 × 235 × 13 mm   ·   358 g
Sprog Engelsk  

Se alt med Dean L. Monthei ( f.eks. Hardcover bog og Paperback Bog )