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RF and Microwave Microelectronics Packaging II Softcover reprint of the original 1st ed. 2017 edition
RF and Microwave Microelectronics Packaging II
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
172 pages, 130 Tables, color; 77 Illustrations, color; 50 Illustrations, black and white; XII, 172 p
| Medie | Bøger Paperback Bog (Bog med blødt omslag og limet ryg) |
| Udgivet | 9. juni 2018 |
| ISBN13 | 9783319847191 |
| Forlag | Springer International Publishing AG |
| Antal sider | 172 |
| Mål | 150 × 220 × 10 mm · 272 g |
| Sprog | Tysk |
| Klipper/redaktør | Kuang, Ken |
| Klipper/redaktør | Sturdivant, Rick |