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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology Cher Ming Tan 2013 edition
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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology
Cher Ming Tan
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
120 pages, 73 black & white illustrations, 2 colour illustrations, biography
| Medie | Bøger Paperback Bog (Bog med blødt omslag og limet ryg) |
| Udgivet | 4. maj 2013 |
| ISBN13 | 9789814451208 |
| Forlag | Springer Verlag, Singapore |
| Antal sider | 103 |
| Mål | 155 × 235 × 6 mm · 1,88 kg |
![Cover for Cher Ming Tan · Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections - Springer Series in Reliability Engineering (Paperback Bog) [2011 edition] (2013)](https://imusic.b-cdn.net/images/item/original/416/9781447126416.jpg?cher-ming-tan-2013-applications-of-finite-element-methods-for-reliability-studies-on-ulsi-interconnections-springer-series-in-reliability-engineering-paperback-bog&class=scaled&v=1410620946)
![Cover for Cher Ming Tan · Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections - Springer Series in Reliability Engineering (Hardcover bog) [2011 edition] (2011)](https://imusic.b-cdn.net/images/item/original/091/9780857293091.jpg?cher-ming-tan-2011-applications-of-finite-element-methods-for-reliability-studies-on-ulsi-interconnections-springer-series-in-reliability-engineering-hardcover-bog&class=scaled&v=1394616648)
